Mfg Part Number: 64 00009 001 | Alternate P/N: 6400009001 | NSN : 5962-01-135-5397 |
NIIN : 011355397 | CAGE Code : 21562 | Manufacturer: General Dynamics Ots Inc |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for choosing NSN Catalogue for all your operational needs. You have reached our NSN RFQ Page which features our in-demand NSN 5962-01-135-5397 part 64 00009 001 with Microcircuit Memory manufactured by MFG General Dynamics Ots Inc. Some of these items include part number 64 00009 001, and various others, all of which have been subjected to a number of quality assurance measures, tests, verifications, and assessments. At NSN Catalogue, we make it our priority to only source from top global manufacturers that we trust, assuaging the worry of receiving quality items from us.
The NSN 5962-01-135-5397 products 64 00009 001 that we feature by MFG General Dynamics Ots Inc are paired alongside CAGE Code 21562. NSN Catalogue utilizes CAGE Codes, allowing our customers to narrow down our vast listings by using our optimized search engine and filters. If you are familiar with the CAGE Codes associated with the particular NSN parts and components you wish to purchase, we invite you to use them. If you have more information regarding the NSN items you wish to purchase, please provide such details in the provided RFQ form below. When you fill out a form, in return, you will be provided a competitive quote for your comparisons in just 15 minutes or less.
MRC | Criteria | Characteristic |
---|---|---|
MEMORY | ADAQ | BODY LENGTH1 180 INCHES MINIMUM AND 1 220 INCHES MAXIMUM |
MEMORY | ADAT | BODY WIDTH0 560 INCHES MINIMUM AND 0 600 INCHES MAXIMUM |
MEMORY | ADAU | BODY HEIGHT0 080 INCHES MINIMUM AND 0 130 INCHES MAXIMUM |
MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING1 0 WATTS |
MEMORY | AFGA | OPERATING TEMP RANGE-55 070 0 DEG CELSIUS |
MEMORY | AFJQ | STORAGE TEMP RANGE-65 0125 0 DEG CELSIUS |
MEMORY | AGAV | END ITEM IDENTIFICATION4920-01-054-8585 81755 |
MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE |
MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC AND GLASS |
MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
MEMORY | CQWX | OUTPUT LOGIC FORMMETAL OXIDE-SEMICONDUCTOR LOGIC |
MEMORY | CQZP | INPUT CIRCUIT PATTERN8 INPUT |
MEMORY | CRHL | BIT QUANTITY2048 |
MEMORY | CSWJ | WORD QUANTITY256 |
MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC0 5 VOLTS MAXIMUM POWER SOURCE |
MEMORY | CZEQ | TIME RATING PER CHACTERISTIC1000 00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME LOW TO HIGH LEVEL OUTPUT |
MEMORY | CZER | MEMORY DEVICE TYPEROM |
MEMORY | TEST | TEST DATA DOCUMENT16340-64-00009 DRAWING THIS IS THE BASIC GOVERNING DRAWING SUCH AS A CONTRACTOR DRAWING ORIGINAL EQUIPMENT MANUFACTURER DRAWING ETC EXCLUDES ANY SPECIFICATION STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRA |
MEMORY | TTQY | TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT |
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